(Washington, 20th) – As China ramps up its semiconductor development in response to U.S. sanctions, ASML CEO Christophe Fouquet shared insights into China’s current progress, emphasizing that the country remains a decade behind the U.S. in chip technology. However, he noted that the global market still relies heavily on China’s production of traditional chips.
In an interview with German media Handelsblatt, reported by tech media WccfTech, Fouquet highlighted that while China’s semiconductor technology lags behind that of the U.S. by 10 years, the country’s expertise in manufacturing traditional chips gives it a significant advantage.
Fouquet stressed the importance of Chinese-made traditional chips in filling the supply-demand gap in Europe, pointing out that Europe has a long way to go before achieving self-sufficiency in semiconductor production.
When asked about China’s ability to recreate extreme ultraviolet (EUV) lithography machines, Fouquet was clear that it remains far out of reach due to the high complexity of EUV development.
He also mentioned that if major global powers plan to impose further restrictions on China, they must first establish robust semiconductor production plans in their own countries, or else the supply chain will struggle to meet industry demands.
